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  • Writer's pictureFlex Plus Tech team

The Differences Between Exposure and Laser Direct Imaging for Flex PCB Manufacturing

In flex PCB manufacturing, selecting the right imaging technology is crucial for achieving high-quality results and cost-effective production. Two primary methods used are Exposure and Laser Direct Imaging. Understanding the differences between these methods can help flex PCB manufacturers choose the best approach for their specific needs.

1. What is Exposure for Flex PCB Manufacturing?

Definition and Working Principle

Exposure in the process of making flex PCBs involves transferring circuit patterns onto a photosensitive layer of the flex PCB through photomasks. Exposure to light, by aligning with the flex PCB and illuminating through the mask, is done so as to create a circuit pattern in the photosensitive material.



Main Features and Benefits

  • Reliability: Traditional Exposure is a widely recognized technology that has been successfully employed in flex PCB manufacturing for many years. Its predictability plus robustness make it an option respected by numerous manufacturers.

  • Cost-effectiveness: Photomask costs are reasonable for high-volume production, so conventional exposure is cost-effective in producing large quantities of flexible PCBs.

  • Established Technology: This means that traditional Exposure processes are matured and have become well-understood, hence they provide stable predictable manufacturing conditions.

Typical Applications in flex PCB ManufacturingIn standard flexible PCB production such as basic to moderately complex designs, traditional exposure is frequently used. On a mass scale, this method is perfect since startup costs for photomasks can be distributed among many units.


2. What is Laser Direct Imaging for Flex PCB Manufacturing?

Laser Direct Imaging (LDI) refers to a process of manufacturing printed circuit boards by using computer controlled laser to expose the circuit pattern directly on the photosensitive layer of flexible PCB. The laser scans the flexible PCB based on the digital design file, and exposes the photosensitive material, without any physical photomask.

Laser Direct Imaging for manufacturing

Major Features and Benefits

  • High Precision and Resolution: It is highly accurate with very clearly visible images that are useful for intricate or dense circuit designs.

  • Flexibility: This technique allows designs to be changed quickly, making it more suited for rapid prototyping and small scale production runs.

  • Reduced Environmental Impact: The HDI process reduces chemical usage and waste because no photomask is needed.

Typical Applications in Flexible PCB Manufacturing

Laser Direct Imaging is ideal for applications that require high-precision results and complexity, such as HDI boards, flexible PCBs, advanced electronics, etc. It works well with delicate features, as well as prototypes and low-volume production applications that require frequent design changes.


3. Key Differences Between Exposure and Laser Direct Imaging

Precision and Resolution

Exposure: Precision is influenced by the quality of photomasks and alignment processes. While high-quality results can be achieved, there is a risk of errors due to mask imperfections and alignment issues.

LDI: Provides superior precision and resolution due to direct imaging with a laser, allowing for detailed and complex circuit patterns.

Cost and production efficiency

Exposure: Low initial investment. Subsequent production costs include the production and processing of photomasks, and there may be potential mask-related problems in production. But the cost is relatively low for mass production.

LDI: The price of the machine equipment is high, and the initial capital investment is large. The overall cost is reduced later by eliminating photomasks and speeding up production. It is very efficient for rapid prototyping and small-batch production.

Flexibility and Adaptability

Exposure: Less flexible, design changes require new photomasks and adjustments to the exposure process, time-consuming and costly.

LDI: Highly flexible, allows for quick updates to designs, adapting well to changes in production requirements.

Environmental Impact

Exposure: Involves chemical processes for photomask creation and handling, resulting in greater environmental impact.

LDI: More environmentally friendly due to reduced chemical usage and waste.

flexible printed circuit, fpcb, flex pcb

4. Advantages of Exposure Process in Flex PCB Manufacturing

Proven Reliability

Conventional exposure is a time-tested method that produces boards with proven reliability. Proven techniques and processes guarantee PCB manufacturers predictable, high-quality results.

Cost Efficiency for High-Volume Production

For high-volume manufacturing, photomask costs can be controlled by high yields. Conventional exposure is suitable for the production of standard and high-volume flexible PCBs, providing a cost-effective solution for the production of flex PCBs.

Proven Techniques and Expertise

Conventional exposure is well known and widely used in the industry. Familiarity with proven processes enables manufacturers to leverage existing expertise and infrastructure for efficient production.

Applicable to a wide range of PCB types

Conventional exposure is versatile and can be used for a wide range of PCB types, including standard and medium-complexity PCBs as well as flex PCBs.


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5. When to use laser direct imaging?

LDI's high resolution and accuracy make it ideal for producing HDI PCBs and flexible PCBs. It can handle very complex circuit patterns and adapt to flexible substrates, ensuring reliable performance in specialized applications.


Both exposure and LDI technologies are constantly evolving, and advances in photomask materials and laser systems are driving improvements in accuracy, efficiency, and environmental impact. As the demand for high-performance and miniaturized electronic products continues to grow, LDI will also become more common due to its accuracy and flexibility. However, exposure still plays an important role in mass production and standard applications.


Flex Plus (Xiamen) Co., Ltd. is a professional flex PCB manufacturer in China. Our products cover single sided, double sided, multilayer flex PCB, Rigid-flex, sculpturer flex PCB and other types of flexible PCBs, which can meet the needs of customers for all kinds of products.

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