With the birth and development of Flex PCB and Rigid PCB, the product of Rigid-flex circuit board was arise. Therefore, the Rigid-flex circuit board is the combination of flexible circuit board and Rigid PCB after pressing and other processes, according to the relevant process requirements combined together to form a circuit board with characteristics of Flexible PCB and Rigid PCB, which needs to be copper-plated in the process of Rigid-flex circuit board production.
At present, when copper-plated Rigid-flex circuit boards, most of the anti-plating tape is used to protect the flex circuit board. Although it can protect the flex circuit board from the corrosion of the liquid. However, because the anti-electroplating tape is made of PET, which is an insulating material, current cannot pass through it when electroplating copper, and it is non-conductive. Therefore, a large amount of copper slag will be irregularly deposited on the anti-plating tape during the chemical precipitation of copper. At the same time, due to the inability to electroplate copper by current, some copper slag falls off and causes pollution in the tank liquid, and the copper slag resistant to electroplating tape is also very difficult to clean, which seriously affects the production efficiency and has certain limitations. Therefore, Flex Plus propose a copper plated structure of Rigid-flex circuit board to solve the above problems.
The technical solution for the Rigid-flex circuit boards:
This Rigid-flex circuit board copper-plated structure includes anti-plating tape main body, copper foil layer, PI (Polyimide) film layer, adhesive layer, and release paper layer.
There is a support structure inside the main body of the anti-electroplating tape, and the support structure is fixedly connected to the bottom surface of the release paper layer.
There is a fixed structure inside the support structure, and both the support structure and the fixed structure are circular.
A set of connecting plates are fixedly connected to the inner wall of the supporting structure, and the side of each connecting plate away from the supporting structure is fixedly connected to the outer surface of the fixed structure.
There is a through hole on the left side of each connecting plate, and each through hole is rectangular.
There is a model label inside the support structure, and the bottom surface of the model label is fixedly connected to the inner wall of the support structure.
The adhesive layer is silicone pressure-sensitive adhesive, and the thickness of the adhesive layer is 10 to 40 microns.
The right end of the main body of the anti-electroplating tape is fixedly connected with a tearing piece, and the upper and lower sides of the tearing piece are provided with anti-slip patterns.
Advantages of this technical solution:
This device is provided with a copper foil layer, which can conduct current during the electroplating process of copper and adsorb the copper slag generated during copper plating on its surface, thereby solving the problem of copper slag falling off and making the plating. The copper plating process will not cause pollution to the copper plating solution, and the use of this tape can isolate the chemical solution from corroding the inner soft board, thereby effectively preventing the appearance of the Flex PCB from discoloration and improving the processing quality of the Rigid-flex circuit board. It is equipped with an adhesive layer, which is a silicone pressure-sensitive adhesive with good high temperature resistance, solvent resistance, chemical resistance, good adhesion. And it’s easy to fit, easy to tear off, and no residue will be left after tearing off after high-temperature operations. Residual glue has better performance.
The working principle:
When the staff uses the tape, the main body of the anti-electroplating tape can be pulled outward through the tearing blade, and then according to the production requirements of the Rigid-flex circuit board, the main body of the anti-electroplating tape can be cut into the shape and size required. After cutting, you can take out the Rigid-flex board that needs copper plating, and paste the cut anti-plating tape main body on the surface of the board. During the copper plating process, the copper foil layer on the surface of the anti-plating tape main body can effectively isolate the chemical liquid from the inner layer. At the same time, the copper foil layer can be used to conduct current, thereby adsorbing the copper slag generated during the copper plating process on the surface of the copper foil layer, and preventing the copper slag from falling off in the bath and causing contamination of the potion. After copper plating is completed, the main body of the anti-plating tape can be peeled off.
For more technical questions, please contact Flex Plus gm02@fpc-plus.com
Ring the phone: +86 184 5004 5626
Sending text on whatsapp: +86 184 5004 5626
Comentários