In recent years, with the rapid development of electronic products in the direction of thinness and miniaturization, the demand for flexible printed circuit boards has become increasingly widespread. As a professional flex PCB manufacturer, Flex Plus continues to make breakthroughs in technological innovation. and has recently launched a heavyweight achievement: the thickness of ultra-thin adhesive-free double-sided FPCB has broken through to less than 25μm, and successfully achieved blind via conduction and high-precision aperture control. This technological breakthrough brings new possibilities to various types of high-precision electronic equipment.
Ultra-thin double-sided FPCB: thickness less than 25μm
The focus of Flex Plus's innovation this time is on the extreme thickness control of adhesive-free double-sided flexible circuit boards. Ultra-thin flex PCB has always been the goal pursued by the industry. The thickness of the adhesive-free double-sided FPCB launched by Flex Plus is controlled below 25 μm (the original copper thickness is 22.5 μm), which significantly improves the lightweight and flexibility of flexible circuit boards. This ultra-thin design is suitable for modern miniaturized devices, such as smartphones, smart wearable devices, micro sensors, etc., which can effectively reduce the internal space occupied and improve the portability of the overall device.
What's more worth mentioning is that Flex Plus's adhesive-free double-sided FPCB not only significantly reduce the thickness, but also overcomes the limitations of traditional adhesive materials in terms of temperature resistance and conductivity. The glue-free structure makes flex circuit board more reliable, adaptable to high temperature and high pressure environments, and can still maintain excellent electrical performance under extreme working conditions.
Blind via conduction and precision aperture: achieving high-density connections
In addition to ultra-thin glue-free double-sided flex PCBs, we have also successfully achieved a technological breakthrough in blind hole conduction. The blind hole diameter is as small as 0.05mm, which is a leading level in the industry. Blind via conduction technology allows flexible PCB to achieve high-density electrical connections in a limited space while maintaining structural integrity. This high-precision small hole technology not only improves the integration of flex printed circuit, but also provides more flexibility for complex circuit design.
In the field of high-density packaging, blind hole technology can effectively reduce the space occupied by inter-layer connection points and improve circuit transmission efficiency. We ensure the stability and conductive performance of blind holes through precise aperture control and efficient conduction processes, which enables flexible PCB to support higher signal transmission rates and lower power consumption requirements in communication electronic equipment.
Whole plate gold plating process: ensuring consistent color and superior conductivity
Flex PCB not only has significant breakthroughs in structure and technology, but also reaches new heights in surface treatment of the entire board. Through advanced whole-board gold plating technology, our FPC achieves color consistency throughout the circuit board while ensuring conductive performance. This process not only improves the appearance quality of FPCB, but also enhances its antioxidant properties and extends its service life.
The gold plating process plays a key role in flex PCB manufacturing. Metal gold has good corrosion resistance and conductivity and is suitable for high-demand signal transmission and precision connections. Our entire board gold plating process ensures that the circuit board can maintain stable performance in various harsh environments.
Flex Plus FPCB’s application prospects and industry impact
This technological breakthrough of Flex Plus not only meets the current demand for thinness and miniaturization of electronic equipment, but also provides more possibilities for higher-precision and higher-density circuit design in the future. The combination of ultra-thin glueless double-sided FPCB and high-precision blind hole technology marks that Flex Plus's innovative strength in the flex PCB field has reached a new height. This will not only further promote the application of flex PCB technology in various industries, but also provide more stable and reliable solutions for high-end electronic equipment.
Our flexible PCB technology breakthrough has brought new ideas to the flexible circuit board industry, demonstrating its outstanding strength in technology research and development and product innovation. As more electronic equipment develops towards high precision and miniaturization, our FPCB products will play an increasingly important role in the future, helping various industries achieve technological upgrades and innovative breakthroughs.
Comentários